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Increasing the efficiency of cooling technology is one strategy to decrease the electronic footprint. Furthermore, a more efficient system becomes necessary as users expect smaller but more powerful computing devices.
Previous cooling designs incorporating a dielectric liquid have
created a potential risk of flooding electronic components. However the unique geometric
feature presented by the springtail-based design is able to successfully contain
the dielectric liquid. To address more challenging conditions, Agonafer
estimates that about three or four years of continued development is required before
the membrane design will be able to be implemented into commercial technologies.
Read more about
this fascinating discovery at: https://spectrum.ieee.org/energywise/computing/hardware/meet-the-electronics-cooling-system-400-million-years-in-the-making
Read the study at: https://www.sciencedirect.com/science/article/pii/S0021979717314017
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